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Applied Materials Inc is seeking a Technical Director for Advanced Packaging Integration in Singapore. The role involves leading complex technology and engineering development projects focused on advanced packaging process integration, with an emphasis on materials and process development.
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Job Summary
This role leads complex technology projects to develop next-generation 2.xD packaging concepts and architectures.
The successful candidate will define end-to-end process flows for panel-level packaging while ensuring material compatibility on large form factor substrates.
Applied Materials offers a supportive culture focused on innovation, professional growth, and employee health and wellbeing.
Matching Summary
Match Score: 75
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Applied Materials Inc is seeking a Technical Director for Advanced Packaging Integration in Singapore. The role involves leading complex technology and engineering development projects focused on advanced packaging process integration, with an emphasis on materials and process development.
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Skills & Requirements
Must-have
Master's degree or PhD in Engineering
10 years experience in advanced packaging
Expertise in FOPLP and interposer technologies
Knowledge of lithography, etch, and thin films
Statistical data analysis proficiency (DoE, JMP)
Nice-to-have
Experience mentoring early-career engineers
Ability to present at industry conferences
Strong cross-functional leadership skills
Willingness to travel 20% of the time
Key Requirements
Master's degree with 10 years experience OR PhD with 5 years
Electrical Engineering, Materials Science, or Chemical Engineering background