Smts - 3d Heterogenous Integration Engineer - 2.5d Interposer/bridge/dtc

GlobalFoundries

Base: $118,000.00 - $210,000.00; bonus/equity: not...
2.5d/3d heterogeneous integration
Silicon/glass/mold interposers
Silicon bridge architectures
GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies

Job Summary

  • GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies.
  • This senior technical position entails end-to-end integration responsibility for advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures.
  • Promote technical innovation via patents, internal publications, and robust integration methodologies for 2.5D/3D heterogeneous integration—including silicon/glass interposer, silicon bridge, advanced interconnects, and comprehensive integration control and metrology.

Matching Summary

GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies.

Salary

Base: $118,000.00 - $210,000.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • 2.5D/3D heterogeneous integration
  • silicon/glass/mold interposers
  • silicon bridge architectures
  • end-to-end integration responsibility
  • BEOL processes
  • advanced packaging integration

Nice-to-have

  • technical innovation via patents
  • cross-functional team collaboration
  • project management skills
  • navigate ambiguity

Key Requirements

  • Master’s degree with 10 years of experience
  • PhD with 8 years of experience preferred
  • In-depth knowledge of BEOL processes
  • Advanced packaging integration expertise
  • Strong problem-solving skills
  • Design of experiment expertise
  • Statistical analysis expertise
  • Yield/reliability learning expertise
  • Technical leadership record
  • English fluency

Work Rights

Not specified

Tailored Resume

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