Drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies
Job Summary
Drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.
Own analog blocks for high-speed interfaces such as clocking, TX/RX front-ends, termination schemes, biasing, and equalization support circuits.
Collaborate with AMS verification, digital, and system teams to enable full-chip integration and validation, and participate in silicon bring-up, debug, and characterization.
Matching Summary
Drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.
Skills & Requirements
Must-have
High-speed analog/mixed-signal circuits
Die-to-Die interconnects
UCIe standard
Advanced packaging technologies
Schematic design and simulation
Signal integrity and noise analysis
Nice-to-have
Mentoring junior engineers
Leading technical discussions
Power integrity and thermal considerations
Package-aware design flows
Key Requirements
12+ years analog/mixed-signal IC design experience