This role involves driving improvements in Thermal & Plasma Enhanced ALD system parts longevity and stability to enable reliable deposition of next-generation thin film materials
Job Summary
This role involves driving improvements in Thermal & Plasma Enhanced ALD system parts longevity and stability to enable reliable deposition of next-generation thin film materials.
The successful candidate will formulate new protective and release coating formulations while leveraging expertise in atmospheric and vacuum-based etch approaches.
ASM values diversity, inclusion, and sustainability while offering development programs to support employee growth in a collaborative culture.
Matching Summary
This role involves driving improvements in Thermal & Plasma Enhanced ALD system parts longevity and stability to enable reliable deposition of next-generation thin film materials.
Skills & Requirements
Must-have
Thermal & Plasma Enhanced ALD systems
Vacuum chamber component coating
Surface engineering processes
High volume semiconductor clean room
Root-cause failure investigations
Nice-to-have
Experience with ASM EmerALD systems
Customer engagement skills
Self-managed project execution
Entrepreneurial mindset
Collaborative global team work
Key Requirements
Bachelor's degree in Materials Science, Physics, or Chemical Engineering
1-5 years experience in ALD, PECVD, or PVD technology
Solid understanding of Design-of-Experiments execution
Familiarity with SEM, TEM, XRD, Ellipsometry, and XPS characterization
Experience in high volume semiconductor clean room environments