Package Design Engineer

Teledyne Technologies Incorporated

Saint-Egrève, France
Package design flow management
Microelectronics packaging design
Packaging layout with cadence apd
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews

Job Summary

  • The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
  • The role involves monitoring emerging technologies and leading R&D or continuous-improvement initiatives to shape future generations of imaging packages.
  • At Teledyne e2v, you join a team where innovation, human values and work‑life balance come together, offering work on cutting‑edge technological projects with high impact.

Matching Summary

The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.

Skills & Requirements

Must-have

  • Package design flow management
  • Microelectronics packaging design
  • Packaging layout with Cadence APD
  • Technical interface with vendors
  • Signal and power integrity

Nice-to-have

  • Customer focused individual
  • Team-worker
  • Ability to adapt and communicate
  • Autonomy to plan for results
  • Continuous improvement mindset

Key Requirements

  • First confirmed experience in packaging design
  • Mastering packaging layout meeting signal/power integrity aspects
  • Knowledge basic mechanical design
  • Experience in technical management of package vendors
  • Good level of English (B2 minimum) and French

Work Rights

Not specified

Tailored Resume

Cover Letter