Responsible for the technical performance, maintenance, and continuous improvement of plating equipment within our semiconductor manufacturing facility
Job Summary
Responsible for the technical performance, maintenance, and continuous improvement of plating equipment within our semiconductor manufacturing facility.
Collaborate with process engineers to optimize plating parameters and equipment settings for enhanced yield, quality, and cost-efficiency.
Ensure all equipment operations and maintenance activities adhere to safety regulations, environmental standards, and NXP's quality management systems.
Matching Summary
Responsible for the technical performance, maintenance, and continuous improvement of plating equipment within our semiconductor manufacturing facility.
Skills & Requirements
Must-have
Plating equipment maintenance and troubleshooting
Electroplating and electroless plating knowledge
Semiconductor fabrication processes
Mechanical, electrical, and control systems
Root cause analysis methodologies
Statistical Process Control (SPC)
Nice-to-have
Cleanroom environment familiarity
Automation systems and PLCs
Continuous improvement mindset
Cross-functional team collaboration
Key Requirements
Knowledge of plating process
Familiarity with semiconductor fabrication processes
Strong understanding of mechanical, electrical, and control systems
Knowledge in troubleshooting and root cause analysis
Knowledge with statistical process control and data analysis tools