Operator (adhesion Promoter, Package Saw & Trim And Form))
ON Semiconductor
Lapu-Lapu City, Philippines
Not specified
Operate wafer scribe and break equipment
Perform die sort and die attach functions
Execute lead bonding and seal operations
ON Semiconductor is seeking an Operator for their semiconductor production facility in Lapu-Lapu City, Philippines. The role involves performing back-end assembly functions and operating equipment for various manufacturing processes, requiring technical skills and a relevant educational background
Job Summary
The role contributes to advancing high-precision semiconductor production by applying technical skills in back-end assembly test operations.
Responsibilities include operating various equipment for functions such as wafer scribe, die sort, die attach, and packaging.
onsemi is driving disruptive innovations to help build a better future with a focus on automotive and industrial end-markets.
Matching Summary
Match Score: 75
ON Semiconductor is seeking an Operator for their semiconductor production facility in Lapu-Lapu City, Philippines. The role involves performing back-end assembly functions and operating equipment for various manufacturing processes, requiring technical skills and a relevant educational background.