Physical Failure Analysis Engineer

NXP

Kuala Lumpur, Malaysia
Scanning electron microscope (sem)
Transmission electron microscope (tem)
Energy dispersive x-ray spectroscopy (edx)
Physical failure analysis involves the localisation, imaging, and characterisation of manufacturing defects in products

Job Summary

  • Physical failure analysis involves the localisation, imaging, and characterisation of manufacturing defects in products.
  • Analysts will collaborate with cross-departmental teams such as Customer Quality Engineering and Manufacturing.
  • Understanding of manufacturing processes and root cause of defects is essential.

Matching Summary

Physical failure analysis involves the localisation, imaging, and characterisation of manufacturing defects in products.

Skills & Requirements

Must-have

  • Scanning Electron Microscope (SEM)
  • Transmission Electron Microscope (TEM)
  • Energy Dispersive X-ray Spectroscopy (EDX)
  • Focused Ion Beam (FIB)

Nice-to-have

  • Experience in laboratory environment
  • Strong problem solving skills
  • Good communication skills

Key Requirements

  • Bachelor's or Master's degree in Electrical/Electronics/Materials Engineering
  • Fresh Graduates or with not more than 2 years’ work experience
  • Basic technical knowledge of semiconductor physics

Work Rights

Not specified

Tailored Resume

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