Senor Wire Bonding Manufacturing / Process Development Engineer

ETM Inc

Base: $113,600.00-$151,400.00; bonus/equity: not s...
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Automated wire bonding process expertise
Process development and optimization
Statistical analysis and doe
** ETM Inc is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer who will be responsible for optimizing automated wire bonding processes in microelectronics manufacturing. The role involves hands-on support for production, cross-functional collaboration, and driving continuous improvement efforts. **

Job Summary

  • The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
  • The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
  • Teledyne and all of our employees are committed to conducting business with the highest ethical standards and require all employees to comply with all applicable laws, regulations, rules and regulatory orders.

Matching Summary

Match Score: 75

** ETM Inc is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer who will be responsible for optimizing automated wire bonding processes in microelectronics manufacturing. The role involves hands-on support for production, cross-functional collaboration, and driving continuous improvement efforts. **

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • automated wire bonding process expertise
  • process development and optimization
  • statistical analysis and DOE
  • equipment troubleshooting and maintenance
  • compliance with industry standards
  • cross-functional collaboration

Nice-to-have

  • experience in aerospace or defense manufacturing
  • knowledge of MES systems and digital tools
  • strong communication and training skills
  • continuous improvement mindset
  • lean manufacturing practices

Key Requirements

  • Bachelor’s degree in relevant engineering field preferred
  • 3+ years experience in microelectronics manufacturing
  • Must be US Citizen or PERM Resident

Work Rights

Must have US citizenship or PERM residency

Tailored Resume

Cover Letter