Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics
Job Summary
Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.
Lead pathfinding projects to advance packaging technology, perform materials research, and consult on packaging improvements with a focus on cost, quality, and environmental impact.
We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.
Matching Summary
Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.