Semiconductor Packaging Engineering Intern - Summer 2026

NXP

Austin, TX, US
Packaging solutions implementation
Lab testing and mechanical analysis
Cad tools usage
NXP’s Technology organization ensures delivery of high quality, scalable, cost-competitive technologies to create competitive advantage for customers

Job Summary

  • NXP’s Technology organization ensures delivery of high quality, scalable, cost-competitive technologies to create competitive advantage for customers.
  • The Packaging Innovation team is responsible for implementing packaging solutions for new product introductions and technology development.
  • Interns will work closely with engineers in lab testing, CAD design, and performance modeling to address design, materials, and processing challenges.

Matching Summary

NXP’s Technology organization ensures delivery of high quality, scalable, cost-competitive technologies to create competitive advantage for customers.

Skills & Requirements

Must-have

  • Packaging solutions implementation
  • Lab testing and mechanical analysis
  • CAD tools usage
  • Team collaboration and communication
  • MS Office proficiency

Nice-to-have

  • Finite Element Simulation tools
  • Knowledge of IC packages like QFP, QFN, BGA
  • Statistical Data Analysis and Design of Experiment
  • Soldering and intermetallic compounds knowledge
  • Positive attitude and self-driven

Key Requirements

  • B.S, M.S., or Ph.D. candidate in Materials Science or Engineering
  • Returning to school or graduating after internship term
  • Good communication and presentation skills
  • Working knowledge of MS Office tools

Work Rights

Must be returning to school or graduating after internship term

Tailored Resume

Cover Letter