Package Design Engineer

Teledyne e2v

Saint-Egrève, France
Package design flow management
Microelectronics packaging design
Packaging layout with cadence apd
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews

Job Summary

  • The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
  • The role involves monitoring emerging technologies and leading R&D or continuous-improvement initiatives to shape future generations of imaging packages.
  • Teledyne e2v offers work on cutting-edge technological projects, an innovation-driven environment, career development paths, and a commitment to work-life balance and QHSE/CSR goals.

Matching Summary

The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.

Skills & Requirements

Must-have

  • Package design flow management
  • Microelectronics packaging design
  • Packaging layout with Cadence APD
  • Technical interface with vendors
  • Signal and power integrity

Nice-to-have

  • Customer focused and adaptable
  • Team player with rigor
  • Continuous improvement mindset
  • Innovation driven environment

Key Requirements

  • First confirmed experience in packaging design
  • Mastering packaging layout
  • Knowledge basic mechanical design
  • Good level of English (B2 minimum)

Work Rights

Not specified

Tailored Resume

Cover Letter