Substrate Packaging Defect Metro Tool Owner

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $120,860.00-170,630.00 usd; bonus/equity: no...
Defect inspection tools
Real-time data analysis
Micro-contamination management
Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging

Job Summary

  • Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging.
  • Use defect inspection tools to detect and resolve process issues, collaborating with defect reduction, process integration, and module teams to improve yield.
  • We offer a total compensation package that ranks among the best in the industry.

Matching Summary

Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging.

Salary

Base: $120,860.00-170,630.00 USD; Bonus/Equity: Not specified; Benefits: competitive package including health, retirement, and vacation

Skills & Requirements

Must-have

  • defect inspection tools
  • real-time data analysis
  • micro-contamination management
  • advanced contamination detection
  • tool installation and qualification
  • defect metrology tool ownership

Nice-to-have

  • proactive problem-solving
  • data-driven decision-making
  • cross-functional collaboration
  • adaptability and resilience
  • engineering excellence and sustainability

Key Requirements

  • Bachelor's degree in EE, CE, OE, Materials Science, Physics or related field and 3 years semiconductor experience
  • Master's degree and 2 years semiconductor experience
  • PhD degree and 1+ years semiconductor experience
  • 3+ years micro-contamination management OR Bright/Dark field inspection technologies
  • 3+ years yield analyst or defect reduction owner or defect metrology tool ownership

Work Rights

Not specified

Tailored Resume

Cover Letter