Transport Media And Materials Engineer

Intel

Phoenix, Arizona, USA
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Hybrid
Packaging design software and cad tools
Packaging materials and testing standards
Project management and analytical skills
Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics

Job Summary

  • Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.
  • Lead pathfinding projects to advance packaging technology, perform materials research, and provide consultation on packaging improvements.
  • The company offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefits.

Matching Summary

Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • packaging design software and CAD tools
  • packaging materials and testing standards
  • project management and analytical skills
  • corrugated papers and cushions research
  • cost, quality, and environmental impact focus

Nice-to-have

  • collaboration for innovation
  • reliability acceleration methods
  • consultation on packaging technology
  • customer needs and product roadmaps alignment

Key Requirements

  • 3+ years packaging engineering experience
  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, or related
  • Proficiency with packaging design software
  • Knowledge of packaging materials and testing standards
  • Strong project management skills

Work Rights

Not specified

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