Senior Engineer I - Packaging

Microchip Technology

Burnaby, Canada
Base: $86,000- $186,000; bonus/equity: not specifi...
Ic package design experience
Thermal and electrical simulations
Advanced laminate packaging
Microchip Technology offers a unique opportunity to be part of a global organization that powers the world

Job Summary

  • Microchip Technology offers a unique opportunity to be part of a global organization that powers the world.
  • The role involves overseeing all aspects of IC package development and collaborating with various teams.
  • Employees benefit from a strong culture of growth, stability, and numerous career development programs.

Matching Summary

Microchip Technology offers a unique opportunity to be part of a global organization that powers the world.

Salary

Base: $86,000- $186,000; Bonus/Equity: Not specified; Benefits: Health benefits, retirement savings plans

Skills & Requirements

Must-have

  • IC package design experience
  • thermal and electrical simulations
  • advanced laminate packaging

Nice-to-have

  • leadership and mentoring skills
  • problem-solving abilities
  • communication and presentation skills

Key Requirements

  • BSME, BSEE or BS in Chemical Engineering
  • 5 years of experience
  • knowledge of JEDEC qualification methods

Work Rights

Not specified

Tailored Resume

Cover Letter