Advanced Packaging Substrate Supplier Enablement Lead

Intel Corporation

Phoenix, Arizona, United States
Base: $140,830.00-269,950.00 usd; bonus/equity: st...
Advanced packaging substrate technologies
Supplier readiness and ramp execution
Global supplier development
Lead global substrate supplier development, readiness, and factory ramp execution to support Intel's high performance and AI centric product roadmap

Job Summary

  • Lead global substrate supplier development, readiness, and factory ramp execution to support Intel's high performance and AI centric product roadmap.
  • Influence supplier technology roadmaps and investments to align with program and long range planning needs, managing risks and ensuring accountability.
  • Intel offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Lead global substrate supplier development, readiness, and factory ramp execution to support Intel's high performance and AI centric product roadmap.

Salary

Base: $140,830.00-269,950.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Advanced packaging substrate technologies
  • Supplier readiness and ramp execution
  • Global supplier development
  • Strategic supplier partnerships
  • Drive yield improvements

Nice-to-have

  • Thrive in high-ambiguity environments
  • Strategic mindset
  • Enthusiasm for innovation
  • Continuous learning
  • Structured problem solving

Key Requirements

  • Bachelor's degree and 6+ years of relevant experience
  • Master's degree and 4+ years of relevant experience
  • PhD degree and 2+ years of relevant experience
  • Advanced packaging, substrates, or semiconductor manufacturing experience
  • Leadership in supplier management or technology enablement
  • Experience mentoring and developing technical talent

Work Rights

Not specified

Tailored Resume

Cover Letter