Principal Signal Power Integrity Engineer, Texas Institute For Electronics

The University of Texas at Austin

Austin, TX, United States
Tie pyys industry-competitive salaries; not specif...
On-site
Signal integrity (si) and power integrity (pi) analysis
2.5d/3.0d heterogeneous integration
High-speed interconnect modeling and extraction
This role is to lead and execute comprehensive Signal Integrity (SI) and Power Integrity (PI) simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages

Job Summary

  • This role is to lead and execute comprehensive Signal Integrity (SI) and Power Integrity (PI) simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
  • The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.
  • The Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Matching Summary

This role is to lead and execute comprehensive Signal Integrity (SI) and Power Integrity (PI) simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.

Salary

TIE Pays Industry-Competitive Salaries; Not specified; Not specified

Skills & Requirements

Must-have

  • Signal Integrity (SI) and Power Integrity (PI) analysis
  • 2.5D/3.0D heterogeneous integration
  • High-speed interconnect modeling and extraction
  • Power delivery network (PDN) optimization
  • EDA vendor collaboration
  • Next-gen interface standards tracking

Nice-to-have

  • Technical strategy guidance
  • Mentoring junior engineers
  • Industry standards participation
  • Thermal and mechanical co-simulation knowledge

Key Requirements

  • BS in Electrical Engineering or related discipline
  • 12+ years of SI/PI experience in advanced packaging
  • Expertise with SI/PI and EM extraction tools
  • Proven ability to build package-level electrical models
  • Strong understanding of high-speed signaling fundamentals
  • Experience with PDN design methodology
  • Hands-on scripting and automation skills

Work Rights

Not specified

Tailored Resume

Cover Letter