The position requires the individual to perform full failure analysis until failure mechanism identification on internal and external customer returns
Job Summary
The position requires the individual to perform full failure analysis until failure mechanism identification on internal and external customer returns.
Responsibilities include understanding semiconductor device specifications, using failure isolation techniques, and performing mechanical microprobing at die-level.
The role involves report generation and interaction with internal and external customers and counterparts.
Matching Summary
The position requires the individual to perform full failure analysis until failure mechanism identification on internal and external customer returns.
Skills & Requirements
Must-have
Semiconductor device specifications
Bench test tools and setup
Failure isolation techniques
Chemical handling for decapsulation
Mechanical microprobing at die-level
Device schematics analysis
Nice-to-have
Knowledge of semiconductor failure mechanisms
Familiarity with FA tools
Experience with Image Sensor devices
Key Requirements
BS Degree in ECE, EE, Computer Engineering, or equivalent
Working experience on failure analysis, product analysis, product design, or equivalent is an advantage
Good understanding of semiconductor physics related to transistors