Aptd: Swa Integration On Shift 7 (ios) Td Engineer

Intel

Phoenix, Arizona, United States
Base: $85,200.00-139,810.00 usd; bonus/equity: sto...
Bachelor's degree in stem field
Shift 7 availability required
Semiconductor packaging process knowledge
The role supports Intel Foundry's advanced package substrate roadmap by collaborating with internal Integration teams to demonstrate disruptive packaging architectures

Job Summary

  • The role supports Intel Foundry's advanced package substrate roadmap by collaborating with internal Integration teams to demonstrate disruptive packaging architectures.
  • Engineers provide real-time support for integrated DOEs, NPIs, and excursion responses to ensure 24x7 lot movement through the pilot line.
  • The position offers a competitive total compensation package including stock bonuses and comprehensive health, retirement, and vacation benefits.

Matching Summary

The role supports Intel Foundry's advanced package substrate roadmap by collaborating with internal Integration teams to demonstrate disruptive packaging architectures.

Salary

Base: $85,200.00-139,810.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Bachelor's degree in STEM field
  • Shift 7 availability required
  • Semiconductor packaging process knowledge
  • SPC and PCS experience
  • Statistical design of experiments

Nice-to-have

  • Collaborative leadership mindset
  • Continuous learning mentality
  • Proactive problem-solving capabilities
  • Strong interpersonal skills
  • Mentoring and knowledge transfer

Key Requirements

  • Bachelor's Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, or Polymer Engineering
  • US work authorization required (no sponsorship)
  • Experience owning process tools and equipment troubleshooting

Work Rights

Must have US work authorization

Tailored Resume

Cover Letter