Ic Packaging Engineer

NVIDIA

Israel
Not specified; not specified; comprehensive benefi...
**
Bsc in mechanical or material engineering
2+ years semiconductor packaging experience
Dfm and tooling design knowledge
** NVIDIA is seeking an experienced IC Packaging Engineer to join their team in Israel, focusing on developing sophisticated IC substrates for innovative products. The role requires collaboration with various design and program teams and offers opportunities for hands-on work in a dynamic environment. **

Job Summary

  • NVIDIA is seeking a Package Engineer to lead the development of cutting-edge microelectronics packaging for its Networking Business Unit.
  • The role involves collaborating with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages while ensuring manufacturability readiness.
  • Candidates will monitor substrate and assembly production KPIs, lead task forces for failure analysis, and establish quality standards in a dynamic environment.

Matching Summary

Match Score: 75

** NVIDIA is seeking an experienced IC Packaging Engineer to join their team in Israel, focusing on developing sophisticated IC substrates for innovative products. The role requires collaboration with various design and program teams and offers opportunities for hands-on work in a dynamic environment. **

Salary

Not specified; Not specified; Comprehensive benefits package offered

Skills & Requirements

Must-have

  • BSc in Mechanical or Material Engineering
  • 2+ years semiconductor packaging experience
  • DFM and tooling design knowledge
  • 2D ArtiosCAD and 3D NX/SolidWorks/Creo skills
  • Material properties and metrology tools expertise

Nice-to-have

  • Hands-on FEA mechanical simulation experience
  • Team or project management experience
  • Manufacturing statistics tools background
  • Engineering semiconductor manufacturing processes
  • Curious and creative problem solving style

Key Requirements

  • BSc or equivalent degree in Mechanical/Material Engineering
  • Minimum 2 years relevant work experience in semiconductor packaging
  • Experience with DFM, tooling design, and manufacturing processes

Work Rights

Not specified

Tailored Resume

Cover Letter