This DMTS-grade position will drive GF’s industry leading Photonix platform growth into world class fully packaged electro-optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form factors
Job Summary
This DMTS-grade position will drive GF’s industry leading Photonix platform growth into world class fully packaged electro-optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form factors.
The candidate will bring a strong focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic, and thermal stress plan for chiplet and product module reliability qualification.
Driving GF leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
Matching Summary
This DMTS-grade position will drive GF’s industry leading Photonix platform growth into world class fully packaged electro-optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form factors.
Salary
Base: $166,300.00 - $291,200.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
SiPhotonics packaging expertise
product and module reliability
packaging design rules
materials selection criteria
electrical, photonic, thermal stress plan
test and measurement methodology for modules
photonic and electrical interconnect innovation
Nice-to-have
distinguished leadership on national/international levels
contributing to national R&D agendas
participation in industry standards boards
Key Requirements
MS, or PhD + 20 or more years of experience
Expertise in photonic and electronic package architecture definition
Broad and deep knowledge of global technology and commercial trends
Experience in bringing packaged products from development into production
Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging