2025 Intern - Packaging Engineer

NXP USA INC.

Tianjin, China
**
Ic packaging technology research
New packaging technology development
New package related process development
** NXP USA Inc. is seeking a 2025 Intern in Packaging Engineering to focus on integrated circuit packaging technology research and development in Tianjin, China. The ideal candidate should be pursuing a master’s degree in relevant engineering fields and possess strong communication skills for cross-functional teamwork. **

Job Summary

  • This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development.
  • Work with global team to finish development projects and other tasks.
  • Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.).

Matching Summary

Match Score: 75

** NXP USA Inc. is seeking a 2025 Intern in Packaging Engineering to focus on integrated circuit packaging technology research and development in Tianjin, China. The ideal candidate should be pursuing a master’s degree in relevant engineering fields and possess strong communication skills for cross-functional teamwork. **

Skills & Requirements

Must-have

  • IC packaging technology research
  • New packaging technology development
  • New package related process development
  • Advanced material interface study
  • Advanced IC package failure analysis

Nice-to-have

  • Cross-functional global team environment
  • Independent R&D capability

Key Requirements

  • Master degree
  • Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation majors
  • CET-4 degree or equivalent English level
  • CET-6 is preferred

Work Rights

Not specified

Tailored Resume

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