Senor Wire Bonding Manufacturing / Process Development Engineer
ETM Inc
CA, United States
Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process expertise
Process development and optimization
Statistical analysis and doe
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing
Job Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
Matching Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
Salary
Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
automated wire bonding process expertise
process development and optimization
statistical analysis and DOE
equipment troubleshooting and maintenance
compliance with industry standards
cross-functional collaboration
continuous improvement initiatives
Nice-to-have
experience in aerospace or defense manufacturing
knowledge of high-reliability bonding requirements
MES systems and digital documentation tools
strong communication and training skills
lean manufacturing and 5S practices
Key Requirements
Must be US Citizen or PERM Resident
Bachelor’s degree in relevant engineering field preferred
3+ years experience in microelectronics manufacturing
Proficiency with SPC, DOE, and statistical analysis