Senior Wire Bonding Manufacturing / Process Development Engineer
ETM Inc
CA, United States
$113,600.00-$151,400.00 py
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Automated wire bonding processes
Process development and optimization
Statistical analysis and doe
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The ideal candidate will have hands-on experience with wire bonding equipment, strong analytical skills, and a solid background in manufacturing environments.
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Job Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
Matching Summary
Match Score: 75
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The ideal candidate will have hands-on experience with wire bonding equipment, strong analytical skills, and a solid background in manufacturing environments.
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Salary
$113,600.00-$151,400.00
Skills & Requirements
Must-have
Automated wire bonding processes
Process development and optimization
Statistical analysis and DOE
Production troubleshooting
Root cause and corrective actions
Nice-to-have
Aerospace/defense/semiconductor experience
High-reliability manufacturing
MES systems and digital tools
Lean manufacturing activities
Key Requirements
Bachelor's degree in relevant field
3+ years of experience in microelectronics manufacturing