Senior Technical Solutions Engineer - Advanced Packaging

Intel

Phoenix, Arizona, United States
Base: $160,980.00-311,040.00 usd; bonus/equity: st...
Hybrid
5+ years semiconductor packaging experience
Bachelor's degree in engineering field
Customer relationship management skills
Join Intel Foundry as a cornerstone of customer success for key Packaging and Test accounts

Job Summary

  • Join Intel Foundry as a cornerstone of customer success for key Packaging and Test accounts.
  • The role combines technical expertise with customer relationship management to drive adoption of advanced technology solutions.
  • Employees receive competitive pay, stock bonuses, and comprehensive benefit programs including health and retirement.

Matching Summary

Join Intel Foundry as a cornerstone of customer success for key Packaging and Test accounts.

Salary

Base: $160,980.00-311,040.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • 5+ years semiconductor packaging experience
  • Bachelor's degree in engineering field
  • Customer relationship management skills

Nice-to-have

  • Post graduate degree in engineering
  • Experience with 2.5D/3D and Chiplets
  • Strong problem-solving analytical thinking

Key Requirements

  • Bachelor's degree in Electrical or related Engineering
  • 5+ years in Semiconductor Packaging or Assembly/Test
  • Not eligible for Intel immigration sponsorship

Work Rights

Not specified

Tailored Resume

Cover Letter