Aptd Equipment Engineer

Micron Technology

Hybrid
Advanced packaging technology development
Wafer and die equipment development
Failure analysis, fmea, 8d
Develop and optimize next generation, first of a kind (FAOK) wafer and die equipment to improve capability, productivity and cost

Job Summary

  • Develop and optimize next generation, first of a kind (FAOK) wafer and die equipment to improve capability, productivity and cost.
  • Identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology.
  • Work in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors.

Matching Summary

Develop and optimize next generation, first of a kind (FAOK) wafer and die equipment to improve capability, productivity and cost.

Skills & Requirements

Must-have

  • Advanced Packaging Technology Development
  • wafer and die equipment development
  • failure analysis, FMEA, 8D
  • equipment evaluation and optimization
  • root cause and failure mode analysis
  • wafer bonding, plating, warpage control

Nice-to-have

  • collaborative atmosphere
  • strategic directions
  • model-based problem solving
  • AI tools for resume enhancement

Key Requirements

  • 3+ years semiconductor process or equipment engineering experience
  • 2+ years semiconductor process or equipment engineering experience
  • M.S./Ph. D. or equivalent education
  • Experience with design of experiment techniques (DOE)
  • Proficiency in statistics, preferably in statistical process control
  • Hands on experience with wafer / assembly tools

Work Rights

Not specified

Tailored Resume

Cover Letter