1st Shift Backside Process Support Engineer

Raytheon Australia

Andover, MA, United States of America
86,800 usd - 165,200 usd; not specified; not speci...
Hybrid
Iii-v backside processing
Wafer bonding/debonding
Semiconductor product deposition
This role involves processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment, requiring autonomous work with limited oversight

Job Summary

  • This role involves processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment, requiring autonomous work with limited oversight.
  • You will be responsible for engineering support and training for manufacturing personnel, reviewing lots and wafers requiring special disposition, and supporting tool and process qualification efforts.
  • The position requires strong communication with manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure efficient work center operation and quick resolution of issues on the manufacturing floor.

Matching Summary

This role involves processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment, requiring autonomous work with limited oversight.

Salary

86,800 USD - 165,200 USD; Not specified; Not specified

Skills & Requirements

Must-have

  • III-V backside processing
  • wafer bonding/debonding
  • semiconductor product deposition
  • failure analysis of tools
  • reduce rework and scrap
  • increase process line efficiency

Nice-to-have

  • excellent communicator
  • drive to learn and improve
  • ability to multitask
  • attention to detail
  • work well in small teams

Key Requirements

  • Minimum 6 years relevant experience
  • Advanced degree and 4 years experience
  • Semiconductor processing techniques experience
  • Ability to obtain US security clearance
  • U.S. citizenship required

Work Rights

U.S. citizenship required

Tailored Resume

Cover Letter