Packaging Engineer

TRUMPF SE + Co. KG

Base: $93,253.50 - $112,504; bonus/equity: not spe...
Die bonding and wire bonding processes
Interface characterization for optical kpis
Production equipment ownership and maintenance
This role involves owning critical processes that turn cutting-edge diode laser devices into production-ready powerhouses

Job Summary

  • This role involves owning critical processes that turn cutting-edge diode laser devices into production-ready powerhouses.
  • The successful candidate will drive yield improvement and cost reduction while partnering closely with R&D to industrialize new concepts.
  • TRUMPF offers a culture of collaboration and mutual trust where forward thinkers can boldly try new things.

Matching Summary

This role involves owning critical processes that turn cutting-edge diode laser devices into production-ready powerhouses.

Salary

Base: $93,253.50 - $112,504; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Die bonding and wire bonding processes
  • Interface characterization for optical KPIs
  • Production equipment ownership and maintenance
  • Yield improvement and cost reduction initiatives
  • SPC, MSA, DOE, and JMP/Minitab proficiency

Nice-to-have

  • Experience in lasers or semiconductors manufacturing
  • Familiarity with K&S or F&K wire bonders
  • Six Sigma certification
  • Cleanroom environment comfort
  • Cross-functional team leadership

Key Requirements

  • BS or MS in Mechanical/Electrical Engineering, Materials Science, or Physics
  • 3+ years hands-on experience with die attach and wire bonding
  • Strong statistical analysis skills using JMP or Minitab

Work Rights

Not specified

Tailored Resume

Cover Letter