Advanced Ic Packaging Software Engineer

Intel Corporation

Phoenix, Arizona, US
Base: $111,030.00-211,200.00 usd; bonus/equity: no...
Hybrid
C/c++ programming experience
Experience with eda tools
Software design and architecture
Intel is transforming the world through technological advancements and innovation

Job Summary

  • Intel is transforming the world through technological advancements and innovation.
  • The role involves developing design tools and methodologies for advanced packaging technologies.
  • Employees enjoy competitive pay, stock bonuses, and comprehensive benefits.

Matching Summary

Intel is transforming the world through technological advancements and innovation.

Salary

Base: $111,030.00-211,200.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • C/C++ programming experience
  • Experience with EDA Tools
  • Software design and architecture

Nice-to-have

  • Understanding of AI and ML fundamentals
  • Experience with Agile and Scrum practices
  • Effective communication skills

Key Requirements

  • Bachelor's Degree in Computer Science or related field
  • 2+ years of relevant experience
  • Master's Degree preferred

Work Rights

Not specified

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