Not specified (assume hybrid based on industry norms).
Bachelor's degree in engineering discipline
2-3 years assembly process experience
Wafer bumping or wlcsp packaging knowledge
Silicon Box Pte. Ltd. is seeking a Technical Program Specialist to manage technical projects related to semiconductor production, particularly in wafer-level packaging. The ideal candidate should have relevant experience, strong problem-solving skills, and the ability to communicate effectively with various teams
Job Summary
The Technical Program Specialist manages customer technical projects and serves as the primary point of contact for new quality and reliability programs.
Candidates must possess hands-on experience in wafer-level packaging processes such as wafer bumping, eWLB, or Fanout Packaging.
The role involves collaborating with sales and account management teams to drive market share and resolve complex technical issues.
Matching Summary
Match Score: 85
Silicon Box Pte. Ltd. is seeking a Technical Program Specialist to manage technical projects related to semiconductor production, particularly in wafer-level packaging. The ideal candidate should have relevant experience, strong problem-solving skills, and the ability to communicate effectively with various teams.
Skills & Requirements
Must-have
Bachelor's Degree in engineering discipline
2-3 years assembly process experience
Wafer bumping or WLCSP packaging knowledge
DOE, reliability requirements, material selection
FMEA, Failure Analysis, quality tools
Nice-to-have
SAP or ERP system familiarity
Excellent communication and presentation skills
Willingness to travel as needed
Self-driven problem resolution skills
Cross-functional team collaboration
Key Requirements
Bachelor's Degree in any engineering discipline
2-3 years relevant working experience in back-end semiconductor assembly