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Teledyne MEMS is seeking a Process Engineer/Scientist/Technologist to join their Edmonton team, focusing on supporting the manufacturing processes of microelectromechanical systems (MEMS). The ideal candidate will possess relevant experience in electroplating, wet processing, and wafer bonding, and will thrive in a collaborative environment that emphasizes innovation and quality.
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Job Summary
The Process Engineer will provide technical engineering expertise in Electroplating, Wet process and Wafer Bonding to support all departments and will work within a team that provides stable, standard processes for optimization of current production or support of new development projects.
Your work will power innovation everywhere, from space to healthcare, shaping the future of microelectromechanical systems that power everything from biomedical breakthroughs to space exploration and AI innovation.
We offer the opportunity to work on technologies that impact space, healthcare, and AI in a collaborative, inclusive team environment with opportunities for growth and skill development.
Matching Summary
Match Score: 75
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Teledyne MEMS is seeking a Process Engineer/Scientist/Technologist to join their Edmonton team, focusing on supporting the manufacturing processes of microelectromechanical systems (MEMS). The ideal candidate will possess relevant experience in electroplating, wet processing, and wafer bonding, and will thrive in a collaborative environment that emphasizes innovation and quality.
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Skills & Requirements
Must-have
Electroplating technologies, processes and tools
Bonding technologies, processes and tools
Wet process technologies, wet processes and tools
Process quality metrics and control
Continuous improvement activities
Nice-to-have
Adaptable to changing needs
Creative problem solver
Positive work environment
Thrive on making an impact
Key Requirements
Minimum 2 years relevant bonding and wet processing experience
Bachelors’ degree, diploma or higher in Engineering or Science