Senior Process Engineer - Dry Etch

Intel

Hillsboro, Oregon, United States
Base: $155,520.00-298,440.00 usd; bonus/equity: st...
Hybrid
7+ years hands-on cmos device engineering experience
Direct etch experience in advanced cmos technology
Knowledge of design of experiment (doe) principles
This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve global foundry customers

Job Summary

  • This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve global foundry customers.
  • The position requires extensive hands-on experience with sub-3nm Gate-All-Around (GAA) FETs and front-end dry etch processing.
  • Intel offers a competitive compensation package including stock bonuses, health benefits, and a hybrid work model.

Matching Summary

This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve global foundry customers.

Salary

Base: $155,520.00-298,440.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 7+ years hands-on CMOS device engineering experience
  • Direct etch experience in advanced CMOS technology
  • Knowledge of Design of Experiment (DOE) principles

Nice-to-have

  • Hands-on experience with sub-3nm Gate-All-Around FETs
  • Experience in ramp and high-volume manufacturing environments
  • Demonstrated success in foundry New Product Introduction activities

Key Requirements

  • Bachelor's degree in Electrical Engineering, Physics, or Material Science
  • 7+ years of industry relevant job experience
  • Advanced degree (MS/PhD) preferred

Work Rights

Not specified

Tailored Resume

Cover Letter