Senior Wire Bonding Manufacturing / Process Development Engineer
FLIR
CA, United States
$113,600.00-$151,400.00 py
On-site
Automated wire bonding processes
Process development and optimization
Production support and troubleshooting
Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer to develop and optimize automated wire bonding processes in microelectronics manufacturing. The ideal candidate will have a strong technical background in wire bonding and relevant experience in production support and continuous improvement initiatives
Job Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
Matching Summary
Match Score: 85
Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer to develop and optimize automated wire bonding processes in microelectronics manufacturing. The ideal candidate will have a strong technical background in wire bonding and relevant experience in production support and continuous improvement initiatives.