Senior Package Modeling Engineer

Invidia

CA, United States
Base: 124,000 usd - 195,500 usd; bonus/equity: equ...
Hybrid
Finite element analysis (fea)
Thermo-mechanical behavior assessment
Package reliability analysis
Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms

Job Summary

  • Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
  • Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
  • This role offers an outstanding chance to work alongside world-class talent in an encouraging and ambitious environment.

Matching Summary

Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.

Salary

Base: 124,000 USD - 195,500 USD; Bonus/Equity: equity; Benefits: benefits

Skills & Requirements

Must-have

  • Finite Element Analysis (FEA)
  • thermo-mechanical behavior assessment
  • package reliability analysis
  • advanced semiconductor packaging architecture
  • FEA tools expertise

Nice-to-have

  • cooperative environment commitment
  • pioneering technology contribution
  • world-class talent collaboration

Key Requirements

  • MS or PhD or equivalent experience
  • 5+ years FEA modeling/simulation experience
  • Familiarity with JEDEC reliability standards
  • Practical understanding of advanced semiconductor packaging materials

Work Rights

Not specified

Tailored Resume

Cover Letter