Transport Media And Materials Engineer

Intel Jobs

Phoenix, Arizona, US
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Hybrid
Packaging design software and cad tools
Packaging materials and testing standards
Project management and analytical skills
Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics

Job Summary

  • Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.
  • Lead pathfinding projects to advance packaging technology, perform materials research on corrugated papers and cushions, and provide consultation on packaging improvements.
  • We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Matching Summary

Design and develop shipping packaging solutions for wafer-level, component-level, and system-board products supporting Intel products, foundry services, and warehouse logistics.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • packaging design software and CAD tools
  • packaging materials and testing standards
  • project management and analytical skills
  • reliability acceleration methods and tools
  • corrugated papers and cushions research

Nice-to-have

  • collaborating across teams
  • customer needs and product roadmaps
  • environmental impact focus
  • Six Sigma/Lean manufacturing knowledge

Key Requirements

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, or related field
  • 3+ years packaging engineering experience
  • Proficiency with packaging design software
  • Knowledge of packaging materials and testing standards
  • Strong project management skills
  • Master's degree in engineering (preferred)
  • Semiconductor packaging experience (preferred)
  • Packaging certifications (preferred)
  • Six Sigma/Lean manufacturing knowledge (preferred)
  • Familiarity with international shipping regulations (preferred)

Work Rights

Not specified

Tailored Resume

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