Principal Advanced Packaging Design Engineer

Marvell

Burlington, VT, United States
Base: not specified; bonus/equity: not specified; ...
Extensive experience in substrate design
Mastery in cadence 3dic tools
Ability to lead complex projects
Marvell’s semiconductor solutions are essential building blocks of data infrastructure

Job Summary

  • Marvell’s semiconductor solutions are essential building blocks of data infrastructure.
  • The engineer will lead project teams to deliver innovative packaging solutions.
  • Marvell offers comprehensive benefits that support employees at every stage of their careers.

Matching Summary

Marvell’s semiconductor solutions are essential building blocks of data infrastructure.

Salary

Base: Not specified; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Extensive experience in substrate design
  • Mastery in Cadence 3DIC tools
  • Ability to lead complex projects

Nice-to-have

  • Strong interpersonal skills
  • Willingness to learn new things
  • Experience with signal and power simulations

Key Requirements

  • Bachelor's degree in electrical engineering
  • 15+ years of related professional experience
  • Understanding of advanced 2.5D/3D package technology

Work Rights

Not specified

Tailored Resume

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