Foveros Direct Pathfinding Integration

Intel

Hillsboro, Oregon, US
Base: $141,910.00-269,100.00; bonus/equity: not sp...
On-site
Packaging solutions and materials design
Packaging development process management
Cross-organizational partner consultation
Intel is seeking an experienced professional for the Foveros Direct Pathfinding Integration role, focusing on packaging solutions within semiconductor technology. The position requires a strong background in engineering or related fields, with responsibilities that include managing the packaging development process and consulting with cross-organizational partners

Job Summary

  • Apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials.
  • Manage the packaging development process including artwork, prototypes, qualification testing, and coordination with manufacturing and supply chain partners.
  • Consult cross-organizational partners on product launch, branding, SKU, scaling, and logistics requirements.

Matching Summary

Match Score: 85

Intel is seeking an experienced professional for the Foveros Direct Pathfinding Integration role, focusing on packaging solutions within semiconductor technology. The position requires a strong background in engineering or related fields, with responsibilities that include managing the packaging development process and consulting with cross-organizational partners.

Salary

Base: $141,910.00-269,100.00; Bonus/Equity: Not specified; Benefits: Included

Skills & Requirements

Must-have

  • Packaging solutions and materials design
  • Packaging development process management
  • Cross-organizational partner consultation
  • Thermal, mechanical, electrical design concepts
  • Qualification testing and material certification

Nice-to-have

  • Advanced packaging technology development
  • Strategic supplier management
  • Hybrid bonding process development
  • Leading technology programs
  • Defect reduction and process improvements

Key Requirements

  • Bachelor's degree and 6+ years of experience
  • Master's degree and 4+ years of experience
  • PhD and 4+ years of experience
  • Experience in packaging engineering
  • Experience in process development
  • Experience in technology innovation

Work Rights

Not specified

Tailored Resume

Cover Letter