Packaging Research And Development Engineer

Intel Jobs

Phoenix, Arizona, US
Base: $133,800.00-219,550.00 usd; bonus/equity: no...
Process and material development
Statistical data analysis
Experience with python or machine learning
The candidate will join a world-class embedded die packaging facility and learn advanced substrate manufacturing know-how

Job Summary

  • The candidate will join a world-class embedded die packaging facility and learn advanced substrate manufacturing know-how.
  • Responsibilities include defining equipment configurations and driving continuous process improvements.
  • Intel offers a competitive compensation package along with health, retirement, and vacation benefits.

Matching Summary

The candidate will join a world-class embedded die packaging facility and learn advanced substrate manufacturing know-how.

Salary

Base: $133,800.00-219,550.00 USD; Bonus/Equity: Not specified; Benefits: Competitive pay, stock bonuses, health, retirement, vacation

Skills & Requirements

Must-have

  • Process and material development
  • Statistical data analysis
  • Experience with Python or machine learning

Nice-to-have

  • Engineering troubleshooting skills
  • Experience with organic/inorganic materials
  • Cross-functional teamwork

Key Requirements

  • PhD in Mechanical Engineering or related
  • Minimum 3 months of relevant experience
  • 1+ years of experience in relevant science or engineering field

Work Rights

Not specified

Tailored Resume

Cover Letter