Fab C4/bumping Module Engineer

Intel Retiree Medical Plan Trust

Hillsboro, Oregon, US
Base: $120,860.00-231,670.00 usd; bonus/equity: st...
Hybrid
Equipment and process optimization
Semiconductor wafer processing
Thick metal/via layers, bumping, reflow
Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth

Job Summary

  • Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.
  • The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

Join Intel and build a better tomorrow by extending computing technology to connect and enrich the lives of every person on earth.

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, vacation

Skills & Requirements

Must-have

  • equipment and process optimization
  • semiconductor wafer processing
  • thick metal/via layers, bumping, reflow
  • process control systems
  • excursion prevention and response
  • continuous improvement

Nice-to-have

  • high-performing culture
  • execution with urgency
  • data-driven problem solving
  • thrive in dynamic environments
  • teamwork and leadership skills

Key Requirements

  • Bachelor's Degree in STEM field
  • 6+ years semiconductor Engineering experience
  • Advanced degree or 10+ years semiconductor experience
  • Knowledge of statistics and experimental design
  • Strong data analysis and presentation acumen
  • Strong technical and troubleshooting skills
  • Ability to work across organizational boundaries

Work Rights

Not specified

Tailored Resume

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