Internship: Electro/thermo Migration Reliability Capabilities Of Ic Packages
NXP USA INC.
Eindhoven, Netherlands
Not specified; not specified; not specified
Master of science in microelectronics degree
Affinity with semiconductor reliability physics
Excellent verbal and written english communication
The role involves developing new testing methods to investigate the boundaries of IC package capabilities regarding thermo-migration and electro-migration
Job Summary
The role involves developing new testing methods to investigate the boundaries of IC package capabilities regarding thermo-migration and electro-migration.
This internship offers a great opportunity to develop technical and soft skills while working on real assignments within a multinational environment.
Candidates must be registered as students during the entire 6-month duration of the full-time internship.
Matching Summary
The role involves developing new testing methods to investigate the boundaries of IC package capabilities regarding thermo-migration and electro-migration.
Salary
Not specified; Not specified; Not specified
Skills & Requirements
Must-have
Master of Science in Microelectronics degree
Affinity with semiconductor reliability physics
Excellent verbal and written English communication
Nice-to-have
Team player willing to work internationally
Flexible ability to multi-task
Experience contributing to corporate objectives
Key Requirements
Must be a Master of Science student in Microelectronics
Must be registered as a student for the entire period