$176,000.00 - $242,000.00; not specified; not spec...
Advanced semiconductor packaging
W2w / d2w bonding
Micro bumps, tsv, thermal management
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
The successful candidate will be responsible for developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
$176,000.00 - $242,000.00; Not specified; Not specified
Skills & Requirements
Must-have
Advanced semiconductor packaging
W2W / D2W bonding
micro bumps, TSV, thermal management
new materials and process development
structured problem-solving methodology
semiconductor packaging engineering expert
Nice-to-have
supportive work culture
continuous learning and development
cross-functional collaboration
pushing boundaries of innovation
Key Requirements
BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
10 years of experience in semiconductor packaging development