This role requires a highly capable individual to lead the Thin Films Engineering Department and support high-volume semiconductor wafer manufacturing
Job Summary
This role requires a highly capable individual to lead the Thin Films Engineering Department and support high-volume semiconductor wafer manufacturing.
The successful candidate will be instrumental in fostering team success by aligning with executive leadership and formulating strategic objectives.
TSMC offers a comprehensive compensation package including market-competitive pay, profit sharing, incentive bonuses, and tuition assistance.
Matching Summary
This role requires a highly capable individual to lead the Thin Films Engineering Department and support high-volume semiconductor wafer manufacturing.
Salary
Base: $150,010 - $244,750 per year; Bonus/Equity: Sign-On Bonus and Relocation Bonus eligible; Benefits: Profit sharing, incentive bonuses, tuition assistance, 401(k) match
Skills & Requirements
Must-have
10+ years in semiconductor industry
3+ years people management experience
Expertise in Rapid Thermal Processing
Chemical Vapor Deposition technology
Physical Wafer Deposition technologies
Nice-to-have
Strong leadership and problem-solving skills
Proactive and adaptable to shifting priorities
Background in high-performing team environments
Agile with new technologies
Excellent communication with stakeholders
Key Requirements
Master's or PhD in Physics, Chemical Engineering, Materials Science, or Electrical Engineering
Legal authorization to work in the United States
Available for weekend duty and off-hours support
Work Rights
Must have legal authorization to work in the United States