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RF360 Singapore Pte. Ltd. is seeking a Senior Staff R&D Design Technology Integration Engineer to lead the development of advanced technology platforms for RF Front End Modules in a dynamic environment. The ideal candidate will have extensive experience in semiconductor packaging, process engineering, and quality management.
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Job Summary
This role requires a senior technical specialist to lead the development of new technology platforms for RF Front End Modules in cellular and wireless data markets.
The successful candidate will utilize deep expertise in BEOL processes and OSAT interactions to improve yield, quality, and throughput while formulating industry-leading design guidelines.
Key responsibilities include conducting Design of Experiments (DOE), resolving manufacturing problems with structured methods, and ensuring product readiness for ramp.
Matching Summary
Match Score: 75
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RF360 Singapore Pte. Ltd. is seeking a Senior Staff R&D Design Technology Integration Engineer to lead the development of advanced technology platforms for RF Front End Modules in a dynamic environment. The ideal candidate will have extensive experience in semiconductor packaging, process engineering, and quality management.
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Skills & Requirements
Must-have
10+ years electronics packaging experience
Backend-of-the-Line (BEOL) processes knowledge
Design of Experiments (DOE) execution
OSAT and foundry interface management
SPC, FMEA, and quality metrics expertise
Nice-to-have
Photolithography techniques experience
PCB design and layout tools familiarity
Value engineering and cost reduction ideation
International travel willingness
Key Requirements
Master's Degree or equivalent in Mechanical/Materials/Chemical Engineering
PhD preferred
10+ years experience in electronics packaging
5+ years direct experience in process engineering or product integration
Understanding of IPC, JEDEC, IEEE, ISO, ANSI standards