Internship: Electro/thermo Migration Reliability Capabilities Of Ic Packages

NXP USA INC.

Nijmegen, Netherlands
On-site
Testing and investigating capabilities
Thermo-migration and electro-migration
Semiconductor reliability and physics
NXP USA INC. is seeking a motivated Master's student for a full-time internship focused on developing testing methods for IC packages related to thermo-migration and electro-migration. The role offers the chance to work in a multinational environment while contributing to the company's reliability objectives

Job Summary

  • Develop new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration.
  • This opportunity is within the Corporate Quality, NTI/NPI, & Reliability (CQNR) team, focused on enabling corporate quality & reliability capabilities.
  • Gain experience in a multinational and diverse environment working on real assignments that contribute to NXP’s objectives.

Matching Summary

Match Score: 85

NXP USA INC. is seeking a motivated Master's student for a full-time internship focused on developing testing methods for IC packages related to thermo-migration and electro-migration. The role offers the chance to work in a multinational environment while contributing to the company's reliability objectives.

Skills & Requirements

Must-have

  • testing and investigating capabilities
  • thermo-migration and electro-migration
  • semiconductor reliability and physics

Nice-to-have

  • working in international teams
  • flexible and able to multi-task

Key Requirements

  • Master of Science in Microelectronics
  • registered as a student during the entire period

Work Rights

Not specified

Tailored Resume

Cover Letter