$105,100 - $189,200; not specified; medical, denta...
Hybrid
Co-packaged optics (cpo) systems
Photonics packaging process development
Micro-electronic and micro-optics packaging
This position will engage with leading edge technology companies, transforming photonics as an industry, while contributing to the rapid transformative growth within the Intelligent Infrastructure business unit
Job Summary
This position will engage with leading edge technology companies, transforming photonics as an industry, while contributing to the rapid transformative growth within the Intelligent Infrastructure business unit.
Lead process engineers in this team have responsibility for developing assembly and manufacturing processes, associated tooling, and process control mechanisms to enable high yield manufacturing of complex densely packed photonic systems.
As part of the total rewards package, this position is eligible for a short-term incentive based on performance.
Matching Summary
This position will engage with leading edge technology companies, transforming photonics as an industry, while contributing to the rapid transformative growth within the Intelligent Infrastructure business unit.
Salary
$105,100 - $189,200; Not specified; Medical, dental, and vision insurance plans; 401(k) retirement plan and employee stock purchase plan; paid time off
Skills & Requirements
Must-have
Co-packaged Optics (CPO) systems
Photonics packaging process development
Micro-electronic and micro-optics packaging
Wireline system manufacturing
Process development studies/experiments
Client early engagement
DFM and FMEA guidance
Nice-to-have
Entrepreneurial and high sense of product ownership
Action-oriented
Independent
Structured R&D programs
Key Requirements
6+ years photonics package design
Bachelor's degree in engineering, physics, chemistry, material engineering