Director - Process Integration & Technology Transfer

3D Glass Solutions Inc

Albuquerque, United States
**
Advanced substrate manufacturing experience
Process-of-record definition expertise
Technology transfer to india facility
** 3D Glass Solutions Inc is seeking a Director of Process Integration & Technology Transfer to oversee the manufacturing process flow for their advanced substrate fabrication in India. The ideal candidate will have significant experience in advanced substrates and semiconductor packaging, with a focus on translating technology requirements into scalable production processes. **

Job Summary

  • The role owns the end-to-end manufacturing process flow for the company's advanced substrate fab in India.
  • Candidates must translate product and technology requirements into a manufacturable, qualified, and scalable process-of-record.
  • The position requires leading the transfer of technology from the U.S. or development teams into the India manufacturing environment.

Matching Summary

Match Score: 75

** 3D Glass Solutions Inc is seeking a Director of Process Integration & Technology Transfer to oversee the manufacturing process flow for their advanced substrate fabrication in India. The ideal candidate will have significant experience in advanced substrates and semiconductor packaging, with a focus on translating technology requirements into scalable production processes. **

Skills & Requirements

Must-have

  • Advanced substrate manufacturing experience
  • Process-of-record definition expertise
  • Technology transfer to India facility
  • Glass or organic-core substrate knowledge
  • Yield improvement and failure analysis
  • Equipment selection and qualification
  • Panel-level processing capabilities

Nice-to-have

  • Strong verbal and written communication skills
  • Willingness to adjust to changing circumstances
  • Data management initiative engagement
  • Cooperative team atmosphere fostering
  • Structured problem-solving mentorship

Key Requirements

  • 12-20+ years of experience in semiconductor packaging or substrate manufacturing
  • Bachelor's degree in Chemical Engineering, Materials Science, or related field
  • Experience with ABF buildup, Digital & RF modules, or panel-level processing

Work Rights

Not specified

Tailored Resume

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