Advanced Packaging Technology Development (aptd) Substrate And Wafer Assembly Quality Engineer

Intel Corporation

Phoenix, Arizona, US
Base: $120,860.00-231,670.00 usd; bonus/equity: st...
Substrate manufacturing process flow
Supplier quality system gaps
Quality improvement roadmaps
Elevate quality standards at substrate suppliers to meet customer expectations in an ultra-competitive IFS environment

Job Summary

  • Elevate quality standards at substrate suppliers to meet customer expectations in an ultra-competitive IFS environment.
  • Proactively assess quality system gaps, establish improvement roadmaps, and partner with suppliers to execute disciplined plans.
  • Conduct periodic high-level audits of supplier sites to assess the general effectiveness of their quality management systems.

Matching Summary

Elevate quality standards at substrate suppliers to meet customer expectations in an ultra-competitive IFS environment.

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: Stock bonuses; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • substrate manufacturing process flow
  • supplier quality system gaps
  • quality improvement roadmaps
  • disruptive packaging architectures
  • cross-supplier quality dashboard

Nice-to-have

  • systems thinking
  • strategic execution
  • results-driven ownership
  • disciplined program execution
  • proactive stakeholder leadership

Key Requirements

  • Master's degree in related engineering field
  • 3+ years of experience in substrate manufacturing
  • 8D methodology for systematic problem solving
  • FMEA development, implementation, and maintenance
  • Ability to travel internationally (5 percent)

Work Rights

Not specified

Tailored Resume

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