Principal Package Engineer

Marvell

Santa Clara, CA, United States
Base: 136,880 - 205,000; bonus/equity: not specifi...
10+ years in semiconductor packaging
Experience in substrate and assembly
Flip-chip package development
Marvell’s semiconductor solutions are essential building blocks of data infrastructure

Job Summary

  • Marvell’s semiconductor solutions are essential building blocks of data infrastructure.
  • The package engineering team drives semiconductor package development from concept to mass production.
  • Marvell is committed to providing exceptional, comprehensive benefits that support employees at every stage.

Matching Summary

Marvell’s semiconductor solutions are essential building blocks of data infrastructure.

Salary

Base: 136,880 - 205,000; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • 10+ years in semiconductor packaging
  • Experience in substrate and assembly
  • Flip-chip package development

Nice-to-have

  • Good program management skills
  • OSAT management experience
  • Ability to work independently

Key Requirements

  • Bachelor’s or Master’s degree in ME or Material science
  • 7+ years of professional experience
  • Deep understanding of semiconductor technologies

Work Rights

Not specified

Tailored Resume

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