Technologist, Advanced Packaging Director

Applied Materials

Austin, TX, USA
$176,000.00 - $242,000.00 py
On-site
2.xd packaging concepts
Panel-level packaging technologies
Large form factor substrates
This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates

Job Summary

  • This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates.
  • Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies.
  • You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.

Matching Summary

This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates.

Salary

$176,000.00 - $242,000.00

Skills & Requirements

Must-have

  • 2.xD packaging concepts
  • panel-level packaging technologies
  • large form factor substrates
  • semiconductor processing and integration
  • process equipment and packaging specific materials

Nice-to-have

  • materials science and engineering
  • innovative solutions for customers
  • supportive work culture
  • push the boundaries of what is possible

Key Requirements

  • Master’s degree with 10 years or PhD degree with 5 years of experience
  • In-depth knowledge of advanced 2.xD packaging technologies
  • Expertise in semiconductor processing and integration
  • Proficiency in statistical data analysis
  • Proven capability to lead multi-functional teams

Work Rights

Not specified

Tailored Resume

Cover Letter