Advanced Packaging Td - Principal Engineer, Process Integration

Micron Technology

Dram process and structure knowledge
Hbm process and structure expertise
Model based problem solving skills
The role involves leading cross-site and cross-country projects to ensure HBM technology roadmap milestones are met

Job Summary

  • The role involves leading cross-site and cross-country projects to ensure HBM technology roadmap milestones are met.
  • Candidates must possess deep expertise in DRAM and HBM processes, structures, and reliability test flows.
  • Proficiency in specific software tools including JMP, Yield cube, MobaXterm, Klarity, Klayout, and SPC is required.

Matching Summary

The role involves leading cross-site and cross-country projects to ensure HBM technology roadmap milestones are met.

Skills & Requirements

Must-have

  • DRAM process and structure knowledge
  • HBM process and structure expertise
  • Model based problem solving skills
  • Inline defect and electrical yield data mining
  • DRAM/PKG test structure and program
  • Reliability test flow and fail mechanism analysis
  • JMP, Yield cube, MobaXterm, Klarity, Klayout, SPC software

Nice-to-have

  • Cross-site and cross-country project leadership
  • Technology roadmap milestone achievement
  • Innovative memory and storage solutions focus

Key Requirements

  • Principal level experience in Process Integration
  • Expertise in HBM product development
  • Advanced skill in data mining and modeling

Work Rights

Not specified

Tailored Resume

Cover Letter